SIKAMA Desktop Reflow Oven FALCON 5C
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Features
- The maximum temperature up to 400℃ and temperature uniformity ±2℃
- The maximum substrate capacity dimensions: 5(L)x5.75(W) INCH
- Equipment Dimensions (LxDxH, cm): 135x64x66
Product Information
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MANUFACTURER
SIKAMA -
MANUFACTURING PROCESS
WLCSP/BGA/Ceramic e-WLB(Fan out)/Flip Chip/Wafer Bumping -
Details
It can handle fluxless gold tin reflow, singulated ball reflow of BGA’s, fixtured double-sided boards, large microwave components, and various substrate materials.
BUSINESS CONTACTS
If you have further needs, please contact us, we have a professional staff will serve you.
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Yarny Lin
- Tel : 03-5530377 ext.103
- Mail : Yarny_Lin@tkk.com.tw
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Joyce Peng
- Tel : 03-5530377 ext.103
- Mail : Joyce_Peng@tkk.com.tw
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Criss Wu
- Tel : 03-5530377 ext.104
- Mail : Criss_Wu@tkk.com.tw
